Development and Qualification of Wafer processing in R&D / Production line, with specialization in 1or more module.
Work with Materials / Equipment Suppliers to explore new processes.
Analyse Defects, Failures in Characterization /Rel Tests and establish preventive measures
Interact with fellow engineers proactively to harness synergy across different process / materials
Follow Development methodology and provide update to internal/external customers.
Identify/work on Low cost solutions
Lead sub/Project team; Transfer developed processes to Manufacturing.
File Inventions to protect IP
Requirements:
At least a Master/Bachelor Degree in Microelectronics, Materials, Chemical, Mechanical Engineering.
Knowledge and hands-on skills in Wafer level Processes such as PVD, CVD, Lithography, Wet Etch, Plasma Clean, Plating etc.
> 2 years hands-on R&D experience is preferred.
Fresh graduates with strong aptitude for R&D will be considered.
Keen to learn and build career in the Technology Development, especially in Wafer Level processes for packaging application.
Self-motivated, proactive and hard working; Work independently and be a good team player.
Good analytical skills and detail-oriented with Project Management focus.
Able to work in flexible hours and additional hours, if required.
