新一轮的FAB招聘开始了Job Opening Summary: GF Operation: -------------- Principle and above engineers for Process and Equipment for Etch/Clean Tech/Diff/Imp/TF/CMP/Litho/Metro GF TD: ------- TD TCAD MTS TD BiCMOS Principle TD Device Engineering (NVM) MTS and Principle TD SPICE Modeling Manager TD Logic MTS and Principle SSMC: ------ Implant Manager (Process and Equipment) Senior Process Development Engineer Thin Film Equipment Engineer (CVD) * 1 position, Familiar with Applied HDP (8 inch), Preferably 1 month notice Thin Film Equipment Engineer (PVD) * 1 position, Familiar with Endura (8 inch), Preferably 1 month notice Diffusion Furnance Process Senior Engineer, 2-3 in TSMC is a must, development job scope Product Engineer (eFlash, RF and EEPROM), prefer TSMC candidates 具体要求和职位介绍接下来会跟帖贴出来，有兴趣的筒子请发简历至usmrecruiting@gmail.com,标题注明要申请的职位。如果上诉没有您想要的职位，但是想换工作的话，也可以发送简历并注明想要的工作，一旦有满足您要求的职位空缺我会